陽昇應用材料股份有限公司

關於我們

陽昇應用材料股份有限公司
成立於2012年3月，主要的核心技術有兩個領域。 CHEERING SUN APPLIED MATERIALS CO., LTD. was founded in March 2012，Our main core technology have two fields...... 1. 陶瓷載板：利用自主研發之陶瓷加工技術及厚膜印刷燒結技術，可製造出各種用途之陶瓷載板。特別是有3D結構(雙面導通孔，立體圍繞壁...等等）之設計，可應用為 LED, IC封裝載板，或電路保護元件之基板等用途。

Hybrid Ceramic Substrate：
Using our self-developed R & D of ceramic processing skills and sintering thick film printing technology，we can produce a variety of hybrid ceramic substrate。Especially with the design of 3D structures for (Two-sided via-holes，Dam etc…)，The substrate and other purposes can be applied to LED，IC package substrates，or circuit protection devices。

2. 磁性材料之成型：應用自主研發之一體成型技術，製作微型功率電感 (power choke)所須之磁芯，可依不同領域之須求，提供不同磁性材料系統。使功率電感之設計及製作更具多樣性。

Magnetic Materials Forming：
Application of self-developed R & D molding technology，producing micro power chokes required in the magnetic core，and according to the needs of different fields，we provide different magnetic materials system。Therefore, the power choke design and production’s more diversity。