關於我們

起源與歷史背景 Orientation
Y2009 薄型散熱產品開發及多項專利申請
Design thin-type thermal expansion, and apply multiple patents
Y2010 正式出貨給多家大型平板電腦、製造客戶
Start mass production for several tablet manufacturers
Y2011 開始進行超薄型高導熱材料、多項專利申請
Design ultra-thin high thermal conductivity material 、apply multiple patents
Y2012 超薄型高導熱散熱片獲多家國際智慧型手機客戶承認
Ultra-thin type thermal expansion sheet approved by tier-1 smart phone brand.
Y2013 超薄型高導熱散熱片開始出貨，進入大尺寸薄型製造顯式器應用領域
Ultra-thin type thermal sheet start MP, using on large size LCD application
Y2014-2016 致力於開發新式散熱材並將其導入網通與電視相關產品
Design new type of heat sink (Qsink) in Wi-Fi AP, and TV.
Y2017 開發用於鋁擠, 壓鑄之高導熱鋁料
Development high conductivity material for Aluminum extrusion and die-casting heat sink.
Y2018 成功整合天線與散熱模組，應用於企業用無線路由器．
Integrate antenna and thermal module for Enterprise AP.
XBRIGHT CONFIDENTIAL